Advanced Package Technology
Mobile, including wearable devices and IoT (Internet of Things), data centers for cloud computing, and smart automotives are the most important key trends in the semiconductor industry today. These new ICT (Information and Communication Technologies) trends require flexible, fast-deliverable, and versatile solutions from the semiconductor industry. Only packaging technology can satisfy such demands from the ICT industry. Therfore, packaging technologies will become a leading solution for the future of ICT. Samsung is a leading company in advanced packaging technology development. That is why Samsung Foundry can provide the most cutting-edge semiconductor solutions to customers.
Samsung Foundry's Competitive Edge in Packaging Technology
Samsung Foundry provides the best package solutions through a well-built ecosystem with Samsung memory supplier and OSATs based on out integration experiences for over 30 years(1 billion parts of PoP are already shipped so far). Furthermore, Samsung Foundry provides chip/package co-design services which enables optimized designing from the beginning of the project. Interposer design is also included in Foundry design service in 2.5D solution.
2.5D Interposer(I-Cube™) Development
As higher memory bandwidth is required in diverse applications such as AI, HPC, network and GFX, advanced package is becoming more and more important factor to cover wide I/O of HBM. Samsung Foundry is ready to provide the best 2.5D solution depending on the requirements of our customers as shown in the schematics below :
Mobile Package Development
Samsung Foundry already provides the world best memory integration packge solution in mobile applications. As higher performance and thinner/smaller PKG solutions are required, next generations of PoP technology are already applied to several mobile devices and under development. Our mobile package development is shown below :
Since the very beginning of our semiconductor business, Samsung Foundry has been constantly researching advanced packaging technology. Like other companies on the leading edge, Samsung Foundry maintains a package research team (in our Samsung Semiconductor R&D Center). In addtion, Samsung Foundry possesses a very well maintained facility for the production of our semiconductor products. This combination of R&D and production provides Samsung Foundry with a solid packaging technology development infrastructure, allowing us to provide our customers with the most optimized packaging solutions.
The following contents illustrate our competiveness:
One-stop Solution Providing
Samsung Foundry packages the most devices, from powerful application processors to CIS. Our breadth of packaging allows Samsung Foundry to apply out varied, in-depth experience to nearly all semiconductor devices. This has led to various integration solutions, especially in Package on Package (PoP), Through silicon Via (TSV) and System in Package (SiP). Samsung Foundry is the only company that can provide foundry, testing, packaging, memory integration such as DRAM, flash, and low power memory in one-stop. This ecosystem is the absolutely critical value that no other company in the world can offer.
High Quality and Reliability
Born of our vast experience in packaging semicounductor devices, Samsung Foundry maintains an extensive quality and reliability database. Keeping this amount of data on hand enables us to quickly deliver the most reliable packaging solutions to our customers, making Samsung the first-considered partner for business.
Samsung Foundry leads the way in packaging technology development, with many innovations making their debuts in Samsung devices. Samsung Foundry has many #1 packaging technologies.