| Samsung |
Samsung Electronics to Boost Investment in Logic Chip Businesses to KRW 171 Trillion by 2030 |
2021-05-13 |
| Samsung |
Samsung Electronics Announces Availability of Its Next Generation 2.5D Integration Solution ‘I-Cube4’ for High-Performance Applications |
2021-05-06 |
| Partner |
Synopsys and Samsung Foundry Collaboration Delivers High-Performance Physical Signoff on Samsung SAFE Cloud Design Platform |
2021-04-06 |
| Partner |
Cadence Unveils Next-Generation Sigrity X for Up to 10X Faster System Analysis |
2021-03-16 |
| Partner |
Samsung Foundry Certifies Synopsys IC Validator for 5nm and 4nm Advanced Process Technologies |
2021-02-22 |
| Partner |
Rescale Raises $50 Million in Series C Funding |
2021-02-02 |
| Partner |
Ansys Launches HFSS Mesh Fusion, Redefines Product Development by Enabling Design of Entire Systems |
2021-01-21 |
| Partner |
Cadence Custom/AMS Flow Certified for the Samsung Foundry 3nm Advanced Process Technology for Early Design Starts |
2021-01-21 |
| Partner |
Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs |
2020-12-16 |
| Partner |
Samsung Foundry Adopts Spectre X Simulator for 5nm Design |
2020-12-08 |